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Category:2010 video games
Category:Association football video games
Category:EA Sports games
Category:Electronic Arts franchises
Category:Electronic Arts games
Category:Electronic Arts franchises
Category:Electronic Arts games
Category:Video games developed in Canada
Category:Windows games
Category:Windows-only games
Category:Video games with cel-shaded animation
Category:Video games set in CanadaProtein interactions and kinase regulation in Src family kinase signaling.
Src family kinases (SFKs) represent a subfamily of nonreceptor tyrosine kinases that play critical roles in regulating diverse cellular processes. Although the individual SFKs are well-defined molecular entities, their function within cells is only beginning to be understood. An important first step toward understanding the physiological roles of SFKs is to elucidate the physiological regulation of their functions. In this review, we focus on the mechanisms of protein interactions and the role of phosphorylation in the regulation of SFK signaling.This invention relates to a combined chemical-mechanical polishing (CMP) apparatus and method. The CMP apparatus and method of the invention are particularly useful for the formation of planarization layers during the manufacture of integrated circuits (ICs).
In the manufacture of ICs, planarization of the various layers that are formed on the wafer surface is increasingly important. With increased circuit densities, the wafer topography has become more complex, resulting in a need for a planarized wafer surface. Although there are a number of known planarization techniques, chemical-mechanical planarization (CMP) has become the most commonly used planarization technique. In conventional CMP, a wafer surface is contacted with a polishing pad under a controlled pressure in the presence of a polishing slurry.
The polishing slurry contains abrasive particles that mechanically polish the wafer surface. The slurry is typically a mixture of deionized water and an abrasive such as alumina, silica, or ceria. In addition to abrasive particles, the slurry may contain chemicals that etch the wafer surface or oxidize the wafer surface.
In conventional CMP, a wafer surface is polished for several minutes, but preferably for about 20-30 seconds, with the slurry delivered to the wafer surface by a slurry delivery system, such as a rotating brush or a be359ba680
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